Abstract: . . .  processes had to be developed. The encapsulation of a flexible module also presented special problems to solve, and unique advantages to employ. PV; CIGS absorber; deposition process optimization; heterojunction; process scaling; atomic absorption spectroscopy (AAS); monolithic; laser scribing; high-speed lamination; thermal cycling; 18. SECURITY CLASSIFICATION OF THIS PAGE 19. SECURITY CLASSIFICATION OF ABSTRACT 15. NUMBER . . .
. . .  adhesive. There have been numerous challenges in developing the technology for manufacturing flexible CIGS photovoltaic modules. Three major areas deemed exceptionally challenging were selected by GSE for focused development under the Thin Film PV Partnership Program: 1) CIGS absorber improvement, 2) monolithic integration, and 3) encapsulation. Most conventional techniques for monolithic integration of thin film PV devices . . .
. . .  CLASSIFICATION OF ABSTRACT 15. NUMBER OF PAGES 16. PRICE CODE 20. LIMITATION OF ABSTRACT 14. SUBJECT TERMS: 17. SECURITY CLASSIFICATION OF REPORT Unclassified NSN 7540-01-280-5500 Unclassified Unclassified UL Standard Form 298 (Rev. 2-89) Prescribed by ANSI Std. Z39-18 298-102  . . .
. . .  devices on a polyimide substrate. Novel interconnect schemes and processes had to be developed. The encapsulation of a flexible module also presented special problems to solve, and unique advantages to employ. PV; CIGS absorber; deposition process optimization; heterojunction; process scaling; atomic absorption spectroscopy (AAS); monolithic; laser scribing; high-speed lamination; thermal cycling; 18. SECURITY CLASSIFICATION . . .
. . .  Commerce 5285 Port Royal Road Springfield, VA 22161 13. ABSTRACT (Maximum 200 words): Global Solar Energy initiated an extensive and systematic plan to accelerate the commercialization of thin-film photovoltaics (PV) based on copper indium gallium diselenide (CIGS). The distinguishing feature of the GSE manufacturing process is the exclusive use of lightweight, flexible substrates. GSE developed the technology to fabricate CIGS . . .
. . .  by GSE for focused development under the Thin Film PV Partnership Program: 1) CIGS absorber improvement, 2) monolithic integration, and 3) encapsulation. Most conventional techniques for monolithic integration of thin film PV devices on glass substrates cannot be applied to integrate devices on a polyimide substrate. Novel interconnect schemes and processes had to be developed. The encapsulation of a flexible module also presented . . .
. . .  GSE for focused development under the Thin Film PV Partnership Program: 1) CIGS absorber improvement, 2) monolithic integration, and 3) encapsulation. Most conventional techniques for monolithic integration of thin film PV devices on glass substrates cannot be applied to integrate devices on a polyimide substrate. Novel interconnect schemes and processes had to be developed. The encapsulation of a flexible module also presented . . .
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